1. 2. 3. material content data sheet sales product name tle4209a issued 28. august 2013 ma# MA000982386 package pg-dip-8-4 weight* 519.10 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.347 1.22 1.22 12226 12226 leadframe inorganic material phosphorus 7723-14-0 0.053 0.01 103 non noble metal zinc 7440-66-6 0.213 0.04 411 non noble metal iron 7439-89-6 4.266 0.82 8219 non noble metal copper 7440-50-8 173.237 33.37 34.24 333725 342458 wire noble metal gold 7440-57-5 0.611 0.12 0.12 1177 1177 encapsulation organic material carbon black 1333-86-4 1.622 0.31 3124 inorganic material antimonytrioxide 1309-64-4 6.487 1.25 12496 plastics brominated resin - 6.487 1.25 12496 plastics epoxy resin - 66.487 12.81 128082 inorganic material silicondioxide 60676-86-0 243.246 46.87 62.49 468591 624789 leadfinish non noble metal tin 7440-31-5 7.496 1.44 1.44 14440 14440 plating noble metal silver 7440-22-4 0.832 0.16 0.16 1603 1603 glue plastics epoxy resin - 0.515 0.10 992 noble metal silver 7440-22-4 1.202 0.23 0.33 2315 3307 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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